Product Details:
Solder Paste No-Clean SAC305 in 5cc Syringe 15g T3 Mesh
Printing speeds up to 100mm/sec
Long stencil life
Wide process window
Clear residue
Low voiding
Excellent wetting compatibility on most board finishes
Dispense grade
Compatible with enclosed print heads
Specifications:
Alloy: Sn96.5/Ag3.0/Cu0.5 Mesh Size: T3 Micron (µm) Range: 25-45 Flux Type: Synthetic No-Clean Flux Classification: REL0 Metal Load: 87% Metal by Weight Melting Point: 217-220°C (423-428°F) Packaging: 5cc/15g Syringe Shelf Life: Refrigerated >6 months, Unrefrigerated >2 months